Conventional electroless Cu plating is slow because of its speed-stability trade-off
Original bath control and surface technology enables 10x faster electroless Cu plating
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Company information and contact
|Representative||Shinya Shimizu, CEO|
|Capital||JPY 458,390,000 (including capital reserve)|
|Address||4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan|