STATUS : Under development | Preparing for production | Ready for production | In production
electrochemical sensor
What is an electrochemical sensor
What is an electrochemical sensor

An electrochemical sensor is a sensor that can figure out the status by using redox potential. It is used for the following cases;

  • for environmental and water quality analyses, measurement of the amount of copper, arsenic, and mercury and the like contained in the water.
  • for measurement of the blood glucose level, lactic acid, urine sugar sensor, and glutamic acid etc as a transducer part of a biosensor etc...
Example of Layer constitution
Ag/AgCl electrochemical sensor
Benefits of making electrochemical sensors with P-Flex™ PET
Benefits of making electrochemical sensors with P-Flex™ PET

Usually, the electrochemical sensor is manufactured only by silk screen printing. However, when it is combined with the 3 μm copper wiring of P-Flex ™ PET;

  • Reduction of wiring resistance value.
  • Cost benefit compared to gold paste printing by making gold electrode with gold flash.
  • Because it is a PET base that doesn't absorb water, it can reduce water absorption induced sensor sensitivity trouble, can also be used for flow cell and such.
  • Can be produced in small batches.
  • Production price is negotiable.

For the prototypes, we plan to provide a one-stop service with paste spreading instead of part mounting for roughly the same price.

Measured by W:Au C:Au R:Ag /AgC electrodes with PGSATAT204 P-Flex made by Metrohm Ltd.

Sensors to measure thickness of target molecule based on Oxidation-Reduction Potential(ORP).
A sensor has two gold electrodes and one Ag-AgCl electrodes.

Applications
Gas sensors, pH sensors, biosensors, water quality sensors, ORP sensors

Industries
Measurement equipment, IoT sensor devices

For general and technical inquiries, please contact us from the form below;

About P-Flex™

P-Flex™ is a single-face flex PCB manufactured using the Pure Additive™ method. Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.

Pure-Additive-method

The Pure Additive™ method (*) developed by Elephantech is a concept completely opposite to what had been used until now, using a proprietary manufacturing technology that prints metal nanoparticles with inkjet only on the necessary parts and grows metals by electroless plating technology.
(* Patent No. 6300213 acquired)

By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
Elephantech will continue to reduce its environmental burden and contribute to the achievement of SDGs.

P-Flex™️ manufacturing specifications
Substrate Transparent heat-resistant PET film: 50 µm thick, 125 µm thick
PI (Polyimide) film: 25 µm thick
Line width / interval 200/200 μm min., 200/150 μm min. (option)
Hole diameter 0.5 mm min.
Outline-pattern spacing 0.3 mm min.
Copper foil thickness 3 μm (please consult us if you require a thickness of more than 3 µm)
Panel size 180 × 270 mm max.
Wiring layer Single-sided
Soldermask application UV inkjet printing (green) (waterproof graded soldermask coating is possible for special items)
Transparent and black soldermask coating by silkscreen printing for PET substrate is also under development and may be available upon request.
Legend printing UV inkjet printing (white)
Surface treatment Oxidation prevention treatment, Electroless nickel gold plating (option)
Outline trimming / Hole processing Laser cutting
SMT process Subject to negotiation
Stiffeners When specifying the thickness of the connector part, film stiffeners can be used to adapt to connectors of 200 µm or 300 µm in total thickness.
Component mounted parts and such can be adapted by using FR4 stiffeners of 0.1, 0.3, 0.5, 1.0, and 1.6mm in thickness.
Other stiffeners, electromagnetic wave shield film, double-sided tape and such are also available.
Inspection Optical inspection + opens/shorts test
contact us

Company information
Name Elephantech Inc.
Establishment January 2014
Address 4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan
Capital JPY 506,040,000
Representative Shinya Shimizu, CEO
Business description Development of printed electronics manufacturing technology and provision of related services
URL https://www.elephantech.co.jp/en/
Email hello_en@elephantech.co.jp