Additive Manufacturing Center
By leading the world with AM, we aim to make AM a major manufacturing method in Electronics, Healthcare, Textile and Optics.
＊AM(Additive Manufacturing) uses inkjet and other printing technologies to selectively stack materials onto desired areas.
IMPC™ (In-Mold Printed Circuit)
IMPC ™(In-Mold Printed Circuits) is a design and manufacturing solution that provides an integrated, optimized design for the entire component instead of the traditional manufacturing method where plastics and electronic circuits are designed and manufactured separately.
By integrating the resin and the circuit, a wider range of optimized designs can be achieved, resulting in various advantages such as weight reduction, thinness, and cost reduction.
Features of the Flexible Substrate P-Flex®
P-Flex® is a single-sided flex PCB manufactured using the Pure Additive™ method.
The novel approach to electronic circuit production that Elephantech has developed -- called Pure Additive™ processing -- is based on a totally opposite concept to the conventional method. In this innovative manufacturing method, metallic nano particles are printed only onto the required areas of the board surface, and then electroless plating technology is applied to grow the metal, providing the benefits shown on the right.