IMPC®（In-Mold Printed Circuit）Solution

IMPC®(In-Mold Printed Circuits) is a design and manufacturing solution that provides an integrated, optimized design for the entire component instead of the traditional manufacturing method where plastics and electronic circuits are designed and manufactured separately.

By integrating the resin and the circuit, a wider range of optimized designs can be achieved, resulting in various advantages such as weight reduction, thinness, and cost reduction.

Using proprietary inkjet technology and proprietary high-speed electroless copper plating, P-Flex® circuit film, which is produced completely mold-less, is molded in three dimensions and then integrated with resin through injection molding (film insert molding).

Our manufacturing process achieves low resistance and soldering, prevents ion migration, and lowers material costs. This process overcame various problems found in the past with other printing and three-dimensional wiring methods.

In addition, the initial capital investment can be reduced because existing injection molding machines for film insert molding are used for the process of film 3D molding and resin integration.

The above manufacturing process is just one example, and the process may vary slightly depending on the design of the product.

Example: overhead console (prototype)

This is an image sample of an IMPC® that we have made as a prototype (our asset). As a result of applying IMPC® to an overhead console, which is designed to resemble buttons and lights on the ceiling of an automobile, we were able to obtain various advantages.

• Thinness             : The assembly gap and substrate holding structure can be reduced, and the thickness is less than 5 mm(excluding the light guide part)
• Lighter weight : Three times lighter than commercially available parts with similar functions
• Cost reduction : Reducing the number of parts and wiring connectors drastically reduced the cost of mass production by several dollars (*Our own calculation).
  

Touch sensor, a microcontroller, high power LEDs (with a current value of a few amps), a physical switch and other components are soldered together. You can check out the features in the video below.

If you are interested, please refer to the "Getting started" below and contact us using the contact form at the bottom of this page.

IMPC® solution is not a simple resin-only or circuit-only replacement technology, but rather a design and manufacturing know-how for the efficient integration of both. We are happy to help you implement IMPC® solution technology through the following process

• Listen to your development themes and issues and propose suitable products and application areas
• Examine the merits and demerits of introducing the product and manufacturing method
• Estimate the cost of mass production
• Prototype production
• Training on design and manufacturing know-how
• Provide various kinds of support for mass production
• Introduce a subcontractor (depending on your machining requirements and equipment requirements)

If you are interested, please refer to the "Getting started" below and contact us using the contact form at the bottom of this page.

• Add a variety of features while maximizing interior space
• Thinner and lighter touch sensor LED lighting
• Placing antennas and sensors on the surface
• Install Heaters in the center console and armrests for efficient temperature control

• Automotive, consumer electronics, industrial equipment

Medical sample integrated P-Flex® Electrochemical Sensor with plastic injected part by IMPC® technology.
The aim is to measure, record and monitor the extracellular potential of cells and cytoplasm in real time without using markers such as fluorescence.