The electrostatic capacitive touch sensor electrode uses the transparent soldermask of P-Flex™ PET, a single-sided flexible PCB. As a product, it comes without initial cost and is suitable for use in switches that value thinness or design as it can be made in any shape and form.
- No initial cost and can be produced in any shape and design
- Uses transparent soldermask allowing for permeability in all but the wiring (additional fees apply)
- Space-saving is possible as parts such as LEDs can be mounted
- The connector to the main board utilizes the technological know-how accrued from the development of our own custom flat cable
- Switches can be formed with glass or acrylic as the top layer
Switches that place a premium on thinness and design and that do not deteriorate
Vehicle mounted appliances,Lighting, design centerd appliances, home appliance switches that are prone to being wet, industry equipment that do not use mechanical switches
P-Flex™ is a single-face flex PCB manufactured using the Pure Additive™ method. Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.
The Pure Additive™ method (*) developed by Elephantech is a concept completely opposite to what had been used until now, using a proprietary manufacturing technology that prints metal nanoparticles with inkjet only on the necessary parts and grows metals by electroless plating technology.
(* Patent No. 6300213)
By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
Elephantech will continue to reduce its environmental burden and contribute to the achievement of SDGs.
|Substrate||Transparent heat-resistant PET film: 50 µm thick,
125 µm thick
PI (Polyimide) film: 25 µm thick
|Line width / spacing||200/200 μm min., 200/150 μm min. (option)|
|Hole diameter||0.5 mm min.|
|Outline-pattern spacing||0.3 mm min.|
|Copper foil thickness||3 μm (please consult us if you require a thickness of more than 3 µm)|
|Panel size||180 × 270 mm max.|
|Soldermask coating||UV inkjet printing (green) (waterproof graded soldermask coating is possible for special items)
Transparent, black and white soldermask coatings by silkscreen printing for PET substrate are also under development and may be available upon request.
|Legend printing||UV inkjet printing (white)|
|Surface finish||Oxidation prevention treatment, Electroless nickel gold plating (option)|
|Outline cutting / Hole drilling||Laser cutting|
|Stiffeners||When specifying the thickness of the connector part, film stiffeners can be used to adapt to connectors of 200 µm or 300 µm in total thickness.
Component mounted parts and such can be adapted by using FR4 stiffeners of 0.1, 0.3, 0.5, 1.0, and 1.6mm in thickness.
Other stiffeners, electromagnetic wave shield film, double-sided tape and such are also available.
|Inspection||Visual inspection + opens/shorts test|
|Address||4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan|
|Representative||Shinya Shimizu, CEO|
|Business description||Development of printed electronics manufacturing technology and provision of related services|