IME (In-Mold Electronics) is a technology for integral molding to form three-dimensional molded film which electronic circuit was drawn on and resin. By integrating parts that had been divided into the housing and electronic board, the following effects can be expected.
- Gross weight reduction
- Improve the performance of touch sensors, antennas, etc.
- Improve the quality of design, reduce assembling proress
- Protect circuits
- Reduce cost
In use case of straight wiring, it will be cut if it makes three dimensions, but meander wiring will prevent this disconnection.
straight wiring
meander wiring
vertex value R20mm was used for prototype
Integrally mold with resin by fitting the circuit to the three-dimensional curved surface
flexible PCB that makes use of a milkyway-like origami structure
Tomoe type kirigami structure that allows for 180˚ bends
Applications
Antennas, touch sensors, single-sided circuit mounted
Industries
Mobile, automotive, consumer electronics, drone
Please contact us via the form below for your technical questions. Subscribe to our newsletter to get informed about new products and technologies.
P-Flex™ is a single-face flex PCB manufactured using the Pure Additive™ method. Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.
The Pure Additive™ method (*) developed by Elephantech is a concept completely opposite to what had been used until now, using a proprietary manufacturing technology that prints metal nanoparticles with inkjet only on the necessary parts and grows metals by electroless plating technology.
(* Patent No. 6300213)
By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
Elephantech will continue to reduce its environmental burden and contribute to the achievement of SDGs.
| Substrate | Transparent heat-resistant PET film: 50 µm thick,
125 µm thick PI (Polyimide) film: 25 µm thick |
| Line width / interval | 200/200 μm min., 200/150 μm min. (option) |
| Hole diameter | 0.5 mm min. |
| Outline-pattern spacing | 0.3 mm min. |
| Copper foil thickness | 3 μm (please consult us if you require a thickness of more than 3 µm) |
| Panel size | 180 × 270 mm max. |
| Wiring layer | Single-sided |
| Soldermask application | UV inkjet printing (green) (waterproof graded soldermask coating is possible for special items) Transparent and black soldermask coating by silkscreen printing for PET substrate is also under development and may be available upon request. |
| Legend printing | UV inkjet printing (white) |
| Surface treatment | Oxidation prevention treatment, Electroless nickel gold plating (option) |
| Outline trimming / Hole processing | Laser cutting |
| SMT process | Subject to negotiation |
| Stiffeners | When specifying the thickness of the connector part, film stiffeners can be used to adapt to connectors of 200 µm or 300 µm in total thickness. Component mounted parts and such can be adapted by using FR4 stiffeners of 0.1, 0.3, 0.5, 1.0, and 1.6mm in thickness. Other stiffeners, electromagnetic wave shield film, double-sided tape and such are also available. |
| Inspection | Optical inspection + opens/shorts test |