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IME (In-Mold Electronics)

IME (In-Mold Electronics) is a technology for integral molding to form three-dimensional molded film which electronic circuit was drawn on and resin. By integrating parts that had been divided into the housing and electronic board, the following effects can be expected.

  • Gross weight reduction
  • Improve the performance of touch sensors, antennas, etc.
  • Improve the quality of design, reduce assembling proress
  • Protect circuits
  • Reduce cost
Our P-Flex makes multi-layerization possible not only for using PET substrate but through the process such as vacuum forming with meander copper wiring. These 3D shaped films use the process of the film of insert molding and such and enable the electronic substrate to integrate into the resin part.

In use case of straight wiring, it will be cut if it makes three dimensions, but meander wiring will prevent this disconnection.

straight wiring

straight wiring
Cracks appear

meander wiring
meander wiring
Cracks do not appear

vertex value R20mm was used for prototype

The used prototype's vertex is R20mm<
Example of Layer constitution


Integrally mold with resin by fitting the circuit to the three-dimensional curved surface

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Although the materials of the flexible PCB aren’t expandable, we have succeeded in realizing a stretchable PCB by combining laser cutters and papercutting (kirie) techniques.

Expandable circuit board that makes use of a kirigami structure

We would like to show you an expandable yet robust flexible PCB that makes use of a milkyway-like origami structure. Conventional fleble PCBs aren’t expandable.

How the non-stretchable flexible PCB can stretch

Our solution is a stretchable circuit board that uses a Tomoe-type structure.
Although the materials of the flex PCB do not stretch, it is possible to stretch a circuit board by giving it a Tomoe-type structure.

Tomoe type kirigami structure that allows for 180˚ bends

By adding these N shaped Tomoe type cutlines, no fold marks are added (to the wiring parts), greatly reducing the risk of disconnection and allowing for 180˚ bends.

Antennas, touch sensors, single-sided circuit mounted

Mobile, automotive, consumer electronics, drone


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Shifting from "dissolving unnecessary parts" to "printing onto necessary parts"

P-Flex® is a single-face flex PCB manufactured using the Pure Additive™ method. Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.


The Pure Additive™ method (*) developed by Elephantech is a concept completely opposite to what had been used until now, using a proprietary manufacturing technology that prints metal nanoparticles with inkjet only on the necessary parts and grows metals by electroless plating technology.
(* Patent No. 6300213)

Taking the example of printed circuit boards, the conventional manufacturing method was an extremely long process in which copper foil is manufactured, laminated with film (production of CCL), and laminated with photosensitive materials before the desired copper pattern is achieved by dissolving and discarding the copper foil from unnecessary parts by exposure, development and etching.

Our process achieves the desired copper pattern by printing the metal onto film and growing it, not only forgoing the need for copper foil manufacturing and CCL manufacturing processes but also eliminating the need for the etching process to dissolve and discard the copper foil.

By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
Elephantech will continue to reduce its environmental burden and contribute to the achievement of SDGs.

P-Flex® manufacturing specifications
Substrate Transparent heat-resistant PET film: 50 µm thick, 125 µm thick
PI (Polyimide) film: 25 µm thick
Line width / spacing 200/200 μm min., 200/150 μm min. (option)
Hole diameter 0.5 mm min.
Outline-pattern spacing 0.3 mm min.
Copper foil thickness 3 μm (please consult us if you require a thickness of more than 3 µm)
Panel size 180 × 270 mm max.
Wiring layer Single-sided
Soldermask coating UV inkjet printing (green) (waterproof graded soldermask coating is possible for special items)
Transparent, black and white soldermask coatings by silkscreen printing for PET substrate are also under development and may be available upon request.
Legend printing UV inkjet printing (white)
Surface finish Oxidation prevention treatment, Electroless nickel gold plating (option)
Outline cutting / Hole drilling Laser cutting
Stiffeners When specifying the thickness of the connector part, film stiffeners can be used to adapt to connectors of 200 µm or 300 µm in total thickness.
Component mounted parts and such can be adapted by using FR4 stiffeners of 0.1, 0.3, 0.5, 1.0, and 1.6mm in thickness.
Other stiffeners, electromagnetic wave shield film, double-sided tape and such are also available.
Inspection Visual inspection + opens/shorts test
contact us

Company information
Name Elephantech Inc.
Establishment January 2014
Address 4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan
Capital JPY 310,000,000
Representative Shinya Shimizu, CEO
Business description Development of printed electronics manufacturing technology and provision of related services