IMPC™ (In-Mold Printed Circuit) is a type of IME (In-Mold Electronics) technology where an inkjet-printed circuit film is given a three-dimensional form and integrally molded with various plastic resins.
- By using a PET substrate and making the copper wiring meander (meander wiring), processes such as vacuum forming can be used in achieving a three-dimensional form.
- By integrating the circuit board in a resin component, IMPC™ eliminates the need for a separate housing.
The circuit is made to fit three-dimensional curves and molded in resin as a single-piece.
Straight wiring will be torn when made to be three-dimensional but the problem can be solved by using meander wiring.
Cracks do not appear
- Reduction of total weight
- Reduced number of components
- Improvement in designability by supporting curved surfaces
- Miniaturization compatibility
- Electronic devices can be soldered onto copper circuits
- The use of inkjet printing to form the circuit makes design changes easy
- Wiring stress is lessened by using meander wiring for the three-dimensional parts.
- Thinner, lighter touch sensors and LED lighting
- Performance improvements from being able to place antennas and sensors on the surface
Consumer Equipment, Industrial Equipment