Our production line is currently overcapacitated due to increased demand. You have our sincerest apologies for any inconvenience this may have caused. With regards to the situation, we are putting a stop to direct sales for our one-stop manufacturing service until an order entry system is put in place. We thank you for your understanding.
P-Flex Assembly Express: FPCBA within a week
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When compared to conventional manufacturing processes of flexible substrates, the unique manufacturing method (*) of "printing metal only on the necessary parts by inkjet and using plating technology to grow the metal" has shortened the production process and succeeded in reducing both manufacturing cost and lead time as well as handling prototyping and mass production more flexibly.
(* Patent No. 6300213 acquired)
|P-Flex™️ manufacturing specifications|
|Substrate||Transparent heat-resistant PET film: 50 µm thick,
125 µm thick
PI (Polyimide) film: 25 µm thick
|Line width / interval||200/200 μm min., 200/150 μm min. (option)|
|Temperature during continuous use||Between -20°C and +105°C|
|Copper foil thickness||3μm / 6µm (option)|
|Panel size||180 × 270 mm max.|
|Soldermask application||UV inkjet printing (green)|
|Legend printing||UV inkjet printing (black)|
|SMT process||Metal mask, manual pick and place and reflow compatibility|
|Minimum size of part for assembly||1005M(0402), 0.4mm pitch IC|
|Stiffeners alignment||Available (Connector part thickness alignment, mount part stiffener)|
|Inspection||Optical inspection + opens/shorts test|
Company information and contact
|Representative||Shinya Shimizu, CEO|
|Capital||JPY 458,390,000 (including capital reserve)|
|Address||4-3-8 Hatchobori, Chuo-ku,
Tokyo 104-0032, Japan