STATUS :Under development | Preparing for production | Ready for production | In production



Our production line is currently overcapacitated due to increased demand. You have our sincerest apologies for any inconvenience this may have caused. With regards to the situation, we are putting a stop to direct sales for our one-stop manufacturing service until an order entry system is put in place. We thank you for your understanding.


P-Flex Assembly Express: FPCBA within a week

P-Flex Assembly Express: FPCBA within a week  


Please contact us via the form below for your technical questions. Subscribe to our newsletter to get informed about new products and technologies.


About P-Flex™

Pure-Additive-method

When compared to conventional manufacturing processes of flexible substrates, the unique manufacturing method (*) of "printing metal only on the necessary parts by inkjet and using plating technology to grow the metal" has shortened the production process and succeeded in reducing both manufacturing cost and lead time as well as handling prototyping and mass production more flexibly.
(* Patent No. 6300213 acquired)

P-Flex™️ manufacturing specifications
Substrate Transparent heat-resistant PET film: 50 µm thick, 125 µm thick
PI (Polyimide) film: 25 µm thick
Line width / interval 200/200 μm min., 200/150 μm min. (option)
Temperature during continuous use Between -20°C and +105°C
Copper foil thickness 3μm / 6µm (option)
Panel size 180 × 270 mm max.
Legend printing Single-sided
Soldermask application UV inkjet printing (green)
Legend printing UV inkjet printing (black)
SMT process Metal mask, manual pick and place and reflow compatibility
Minimum size of part for assembly 1005M(0402), 0.4mm pitch IC
Stiffeners alignment Available (Connector part thickness alignment, mount part stiffener)
Inspection Optical inspection + opens/shorts test
For general and technical inquiries, please contact us from the form below;



Company information and contact

Name Elephantech Inc.
Representative Shinya Shimizu, CEO
Establishment January 2014
Capital JPY 458,390,000 (including capital reserve)
No.of employees 23
Address 4-3-8 Hatchobori, Chuo-ku,
Tokyo 104-0032, Japan
URL https://www.elephantech.co.jp/en/