Main Characteristics of P-Flex™ PET

It is inexpensive to mass produce compared to polyimide base materials, and it is suitable for environments with high or extreme humidity due to it being resistive to absorbing moisture. Also, parts other than the pattern or components can have a transparent appearance when transparent resist is used.

 

STATUS : Under development | Preparing for production | Ready for production | In production

 

Layer structure of P-Flex™ PET

P-Flex-PET 

 

Applications
Wiring replacement, FFC replacement, sensor module FPC, film heater, touch sensors

Industries
Consumer electronics, printers, toys, industrial machinery


Concerning the water-resistance of the Flex PCB P-Flex™ (PET substrate)
water-resistance
  • P-Flex™ (PET substrate) can also be specially ordered with a waterproof grade resist coating. This water-resistant P-Flex has been evaluated in-house to comply with IPX-6 and may be used in environments prone to dripping water. (however, coating and such is necessary for areas used for component mounting, etc...)
  • It can also be used in parts that are prone to water intrusion such as equipment used outdoors or in-vehicle body electronics.
  • Using the water-resistant P-Flex™ can reduce manufacturing costs as there is no need to waterproof cables with sealing materials or taping.
 
About P-Flex™

P-Flex™ is a single-face flex PCB manufactured using the Pure Additive™ method. Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.

Pure-Additive-method

The Pure Additive™ method (*) developed by Elephantech is a concept completely opposite to what had been used until now, using a proprietary manufacturing technology that prints metal nanoparticles with inkjet only on the necessary parts and grows metals by electroless plating technology.
(* Patent No. 6300213 acquired)

By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
Elephantech will continue to reduce its environmental burden and contribute to the achievement of SDGs.

P-Flex™️ manufacturing specifications
Substrate Transparent heat-resistant PET film: 50 µm thick, 125 µm thick
PI (Polyimide) film: 25 µm thick
Line width / interval 200/200 μm min., 200/150 μm min. (option)
Hole diameter 0.5 mm min.
Outline-pattern spacing 0.3 mm min.
Copper foil thickness 3 μm (please consult us if you require a thickness of more than 3 µm)
Panel size 180 × 270 mm max.
Wiring layer Single-sided
Soldermask application UV inkjet printing (green) (waterproof graded soldermask coating is possible for special items)
Transparent and black soldermask coating by silkscreen printing for PET substrate is also under development and may be available upon request.
Legend printing UV inkjet printing (white)
Surface treatment Oxidation prevention treatment, Electroless nickel gold plating (option)
Outline trimming / Hole processing Laser cutting
SMT process Subject to negotiation
Stiffeners When specifying the thickness of the connector part, film stiffeners can be used to adapt to connectors of 200 µm or 300 µm in total thickness.
Component mounted parts and such can be adapted by using FR4 stiffeners of 0.1, 0.3, 0.5, 1.0, and 1.6mm in thickness.
Other stiffeners, electromagnetic wave shield film, double-sided tape and such are also available.
Inspection Optical inspection + opens/shorts test
contact us

Company information
Name Elephantech Inc.
Establishment January 2014
Address 4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan
Capital JPY 506,040,000
Representative Shinya Shimizu, CEO
Business description Development of printed electronics manufacturing technology and provision of related services
URL https://www.elephantech.co.jp/en/
Email hello_en@elephantech.co.jp