P-Flex® PET: Flexible Printed Circuits

Features of the PET-base FPC P-Flex®


It is inexpensive to mass produce compared to polyimide base materials, and it is suitable for environments with high or extreme humidity due to it being resistive to absorbing moisture. Also, parts other than the pattern or components can have a transparent appearance when transparent resist is used.

 

PET-base FPC P-Flex

  • No adhesive layer for copper foil, soldermask
  • The cost of mass production is lower than polyimide.
  • Because it is less likely to absorb moisture than polyimide, it is suitable for use in applications that dislike humidity and high humidity environments.
Layer structure of P-Flex® PET

Layer structure of P-Flex® PET 

 

Applications
Wiring replacement, FFC replacement, sensor module FPC, film heater, touch sensors

Industries
Consumer electronics, printers, toys, industrial machinery

Related article
Inquiry form (Fields marked with a * are required)