STATUS : Under development | Preparing for production | Ready for production | In production

P-Flex PI DS: double-sided Polyimide FPC


Ag paste via

Major specs values
L/S 200/150μm
Layer 2 layers
Size 270x180mm
(Large type: 500x360mm)
Surface treatment Cu or ENIG
Substrate 25μm Polyimide
Via Ag paste via


Applications
General FPC replacement, wiring replacement, FFC replacement, sensor module FPC, touch sensors


Industries
Automotive, consumer electronics, printers, toys, industrial machinery

 






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Company information and contact

Name Elephantech Inc.
Representative Shinya Shimizu, CEO
Establishment January 2014
Capital JPY 458,390,000 (including capital reserve)
No.of employees 23
Address 4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan
URL https://www.elephantech.co.jp/en/