STATUS : Under development | Preparing for production | Ready for production | In production

P-Flex PI DS: double-sided Polyimide FPC

Major specs values
L/S 200 / 150 μm
Layer 2 layers
Size 270 x 180 mm
(Large type: 500 x 360 mm)
Surface treatment Cu or ENIG
Substrate 25 μm Polyimide
Via Ag paste via


Applications
General FPC replacement, wiring replacement, FFC replacement, sensor module FPC, touch sensors


Industries
Automotive, consumer electronics, printers, toys, industrial machinery

 






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About P-Flex™

Pure-Additive-method

When compared to conventional manufacturing processes of flexible substrates, the unique manufacturing method (*) of "printing metal only on the necessary parts by inkjet and using plating technology to grow the metal" has shortened the production process and succeeded in reducing both manufacturing cost and lead time as well as handling prototyping and mass production more flexibly.
(* Patent No. 6300213 acquired)

P-Flex™️ manufacturing specifications
Substrate Transparent heat-resistant PET film: 50 µm thick, 125 µm thick
PI (Polyimide) film: 25 µm thick
Line width / interval 200/200 μm min., 200/150 μm min. (option)
Temperature during continuous use Between -20°C and +105°C
Copper foil thickness 3μm / 6µm (option)
Panel size 180 × 270 mm max.
Legend printing Single-sided
Soldermask application UV inkjet printing (green)
Legend printing UV inkjet printing (black)
SMT process Metal mask, manual pick and place and reflow compatibility
Minimum size of part for assembly 1005M(0402), 0.4mm pitch IC
Stiffeners alignment Available (Connector part thickness alignment, mount part stiffener)
Inspection Optical inspection + opens/shorts test
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Company information and contact

Name Elephantech Inc.
Representative Shinya Shimizu, CEO
Establishment January 2014
Capital JPY 458,390,000 (including capital reserve)
No.of employees 23
Address 4-3-8 Hatchobori, Chuo-ku,
Tokyo 104-0032, Japan
URL https://www.elephantech.co.jp/en/