Features of the Polyimide FPC P-Flex™
The Polyimide-base P-Flex™ (hereinafter P-Flex™ PI) is an FPC (Flexible Printed Circuit) where our very own Pure Additive method(*1) is adapted to polyimides. The PET based P-Flex™ (hereinafter P-Flex™ PET) we had developed and sold until now had issues with its range of use limited by the low heat resistance of PET (roughly 150˚C) and having to use low temperature solder for mounting.
This P-Flex™ PI uses polyimides with high heat resistance (roughly 300˚C) as its base material, allowing it to overcome the shortcomings of P-Flex™ PET and improving heat resistance and flame retardancy. Regarding the mounting of parts, the ability to use normal solder has not only expanded the applications but also greatly improved the mountability, and it can now be used just as if it was any normal FPC.
(* 1) Technology to layer copper plating only on silver nanoink
Wiring replacement, FFC replacement, sensor module FPC, film heater, touch sensors
consumer electronics, toys, industrial machinery
P-Flex™ is a single-face flex PCB manufactured using the Pure Additive™ method. Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.
The Pure Additive™ method (*) developed by Elephantech is a concept completely opposite to what had been used until now, using a proprietary manufacturing technology that prints metal nanoparticles with inkjet only on the necessary parts and grows metals by electroless plating technology.
(* Patent No. 6300213 acquired)
By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
Elephantech will continue to reduce its environmental burden and contribute to the achievement of SDGs.
|Substrate||Transparent heat-resistant PET film: 50 µm thick,
125 µm thick
PI (Polyimide) film: 25 µm thick
|Line width / interval||200/200 μm min., 200/150 μm min. (option)|
|Hole diameter||0.5 mm min.|
|Outline-pattern spacing||0.3 mm min.|
|Temperature during continuous use||Between -20°C and +105°C|
|Copper foil thickness||3 μm (please consult us if you require a thickness of more than 3 µm)|
|Panel size||180 × 270 mm max.|
|Soldermask application||UV inkjet printing (green) (waterproof graded soldermask coating is possible for special items)
Transparent and black soldermask coating by silkscreen printing for PET substrate is also under development and may be available upon request.
|Legend printing||UV inkjet printing (white)|
|Surface treatment||Oxidation prevention treatment, Electroless nickel gold plating (option)|
|Outline trimming / Hole processing||Laser cutting|
|SMT process||Subject to negotiation|
|Stiffeners||When specifying the thickness of the connector part, film stiffeners can be used to adapt to connectors of 200 µm or 300 µm in total thickness.
Component mounted parts and such can be adapted by using FR4 stiffeners of 0.1, 0.3, 0.5, 1.0, and 1.6mm in thickness.
Other stiffeners, electromagnetic wave shield film, double-sided tape and such are also available.
|Inspection||Optical inspection + opens/shorts test|
|Address||4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan|
|Representative||Shinya Shimizu, CEO|
|Business description||Development of printed electronics manufacturing technology and provision of related services|