List of flex PCB application products under development

Features of the Polyimide FPC P-Flex™

The Polyimide-base P-Flex™ (hereinafter P-Flex™ PI) is an FPC (Flexible Printed Circuit) where our very own Pure Additive method(*1) is adapted to polyimides. The PET based P-Flex™ (hereinafter P-Flex™ PET) we had developed and sold until now had issues with its range of use limited by the low heat resistance of PET (roughly 150˚C) and having to use low temperature solder for mounting.
This P-Flex™ PI uses polyimides with high heat resistance (roughly 300˚C) as its base material, allowing it to overcome the shortcomings of P-Flex™ PET and improving heat resistance and flame retardancy. Regarding the mounting of parts, the ability to use normal solder has not only expanded the applications but also greatly improved the mountability, and it can now be used just as if it was any normal FPC.
(* 1) Technology to layer copper plating only on silver nanoink

STATUS : Under development | Preparing for production | Ready for production | In production

QFP

Layer structure of P-Flex™ PI

Polyimide-FPC

Single-sided Polyimide FPC

pi-pflex

Applications
Wiring replacement, FFC replacement, sensor module FPC, film heater, touch sensors

Industries
consumer electronics, toys, industrial machinery

 



About P-Flex™

Pure-Additive-method

When compared to conventional manufacturing processes of flexible substrates, the unique manufacturing method (*) of "printing metal only on the necessary parts by inkjet and using plating technology to grow the metal" has shortened the production process and succeeded in reducing both manufacturing cost and lead time as well as handling prototyping and mass production more flexibly.
(* Patent No. 6300213 acquired)

P-Flex™️ manufacturing specifications
Substrate Transparent heat-resistant PET film: 50 µm thick, 125 µm thick
PI (Polyimide) film: 25 µm thick
Line width / interval 200/200 μm min., 200/150 μm min. (option)
Temperature during continuous use Between -20°C and +105°C
Copper foil thickness 3μm / 6µm (option)
Panel size 180 × 270 mm max.
Legend printing Single-sided
Soldermask application UV inkjet printing (green)
Legend printing UV inkjet printing (black)
SMT process Metal mask, manual pick and place and reflow compatibility
Minimum size of part for assembly 1005M(0402), 0.4mm pitch IC
Stiffeners alignment Available (Connector part thickness alignment, mount part stiffener)
Inspection Optical inspection + opens/shorts test
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Company information and contact

Name Elephantech Inc.
Representative Shinya Shimizu, CEO
Establishment January 2014
Capital JPY 458,390,000 (including capital reserve)
No.of employees 23
Address 4-3-8 Hatchobori, Chuo-ku,
Tokyo 104-0032, Japan
URL https://www.elephantech.co.jp/en/