Reference data regarding the minimum bending radius is provided in Table 3-3: Reference data on the minimum bending radius below, which can be used when bending FPCs with metal molds, etc. The Copper foil thickness is 3µm and the substrate is PET. However, it must be noted that the data is provided for reference purposes only and is not a guaranteed value.
Table 3-3: Reference data on the minimum bending radius
|Minimum bending radius R [mm]||0.5|
Reference data on the anti-ionic migration characteristic of the product is provided in Table 3-4 below. Please note, however, that the data is provided for reference purposes only and these are not guaranteed values. The test pattern used consisted of interdigital electrodes placed at 0.5 mm intervals, to which a voltage of 50 V was applied.
While silver is used in the seed layer, copper coating is subsequently applied using electroless plating all over the surface. Therefore, no ionic migration of silver will occur under normal circumstances.
Table 3-4: Reference data on anti-ionic migration
|Condition||Observation of ionic migration|
|85°C 85%Rh 1440 hours||None observed|
All products we ship comply with the RoHS Directive as standard. Also, we do not use substances that are listed as Substances of Very High Concern (SVHC) by the REACH regulation. If required, we will gladly provide certificates of compliance of RoHS and REACH upon request. Please contact us.
The UL94 (flame retardant standard) conformity test has been carried out and the results are as follows.
|PI||VTM-0 equivalent (Pending certification number)|
Reference data on peel strength between the substrate and the copper pattern is shown in Table 3-6. The peel test is based on JIS-K5600 (cross cut method).
Table 3-6: Peel Strength Reference Data
|PI||Passed peel test|
|PET||Passed peel test|
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