Reference data on the flex resistant characteristic of the product is provided in Table 3-3 below. The copper foil’s thickness is 3 µm. Please note, however, that the data is provided for reference purposes only and these are not guaranteed values.
As for the testing method that was used to gather the data, the standard JPCA UB-1 titled ‘Flex Resistance Testing Method for Flex PCB - High speed’ was applied. For testing purposes, samples with a wire width of 0.5mm were tested at a bending speed of 10 bends per second.
|Substrate||Bending radius R [mm]||No. of bends until the resistance value of 1.2 times is achieved|
Reference data regarding the minimum bending radius is provided in Table 3-4 below, which can be used when bending FPCs with a die, etc. The Copper foil thickness is 3µm and the substrate is PET. However, it must be noted that the data is provided for reference purposes only and is not a guaranteed value.
|Minimum bending radius R [mm]||0.5|
Reference data on the anti-ionic migration characteristic of the product is provided in Table 3-5 below. Please note, however, that the data is provided for reference purposes only and these are not guaranteed values. The test pattern used consisted of interdigital electrodes placed at 0.5 mm intervals, to which a voltage of 50 V was applied.
While silver is used in the seed layer, copper coating is subsequently applied using electroless plating all over the surface. Therefore, no ionic migration of silver will occur under normal circumstances.
|Condition||Observation of ionic migration|
|85°C 85%Rh 1440 hours||None observed|
Reference data on peel strength between the substrate and the copper pattern is shown in Table 3-6. However, the peel test is based on JIS-K5600 (cross cut method).
|PI||Passed peel test|
|PET||Passed peel test|
For general and technical inquiries, please contact us from the form below;
P-Flex™ is a single-face flex PCB manufactured using the Pure Additive™ method. Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.
The Pure Additive™ method (*) developed by Elephantech is a concept completely opposite to what had been used until now, using a proprietary manufacturing technology that prints metal nanoparticles with inkjet only on the necessary parts and grows metals by electroless plating technology.
(* Patent No. 6300213 acquired)
By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
Elephantech will continue to reduce its environmental burden and contribute to the achievement of SDGs.
|Substrate||Transparent heat-resistant PET film: 50 µm thick,
125 µm thick
PI (Polyimide) film: 25 µm thick
|Line width / interval||200/200 μm min., 200/150 μm min. (option)|
|Outline-pattern interval||Standard : 0.5 mm min.High : 0.3 mm min.|
|Temperature during continuous use||Between -20°C and +105°C|
|Copper foil thickness||3μm / 6µm (option)|
|Panel size||180 × 270 mm max.|
|Soldermask application||UV inkjet printing (green)|
|Legend printing||Black UV inkjet
(we plan on switching to a white color from May 2019)
|Surface treatment||Oxidation prevention treatment, Electroless nickel gold plating (option)|
|Outline trimming / Hole processing||Laser cutting|
|SMT process||Subject to negotiation|
|Stiffeners alignment||Available (Connector part thickness alignment, mount part stiffener)|
|Inspection||Optical inspection + opens/shorts test|
|Address||4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan|
|Representative||Shinya Shimizu, CEO|
|Business description||Development of printed electronics manufacturing technology and provision of related services|