Reference data regarding the minimum bending radius is provided in Table 3-4 below, which can be used when bending FPCs with a die, etc. The Copper foil thickness is 3µm and the substrate is PET. However, it must be noted that the data is provided for reference purposes only and is not a guaranteed value.
|Minimum bending radius R [mm]||0.5|
Reference data on the anti-ionic migration characteristic of the product is provided in Table 3-5 below. Please note, however, that the data is provided for reference purposes only and these are not guaranteed values. The test pattern used consisted of interdigital electrodes placed at 0.5 mm intervals, to which a voltage of 50 V was applied.
While silver is used in the seed layer, copper coating is subsequently applied using electroless plating all over the surface. Therefore, no ionic migration of silver will occur under normal circumstances.
|Condition||Observation of ionic migration|
|85°C 85%Rh 1440 hours||None observed|
Reference data on peel strength between the substrate and the copper pattern is shown in Table 3-6. However, the peel test is based on JIS-K5600 (cross cut method).
|PI||Passed peel test|
|PET||Passed peel test|
For general and technical inquiries, please contact us from the form below;