Reference data regarding the minimum bending radius is provided in Table 3-4 below, which can be used when bending FPCs with a die, etc. The Copper foil thickness is 3µm and the substrate is PET. However, it must be noted that the data is provided for reference purposes only and is not a guaranteed value.
|Minimum bending radius R [mm]||0.5|
Reference data on the anti-ionic migration characteristic of the product is provided in Table 3-5 below. Please note, however, that the data is provided for reference purposes only and these are not guaranteed values. The test pattern used consisted of interdigital electrodes placed at 0.5 mm intervals, to which a voltage of 50 V was applied.
While silver is used in the seed layer, copper coating is subsequently applied using electroless plating all over the surface. Therefore, no ionic migration of silver will occur under normal circumstances.
|Condition||Observation of ionic migration|
|85°C 85%Rh 1440 hours||None observed|
Reference data on peel strength between the substrate and the copper pattern is shown in Table 3-6. However, the peel test is based on JIS-K5600 (cross cut method).
|PI||Passed peel test|
|PET||Passed peel test|
For general and technical inquiries, please contact us from the form below;
P-Flex™ is a single-face flex PCB manufactured using the Pure Additive™ method. Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.
The Pure Additive™ method (*) developed by Elephantech is a concept completely opposite to what had been used until now, using a proprietary manufacturing technology that prints metal nanoparticles with inkjet only on the necessary parts and grows metals by electroless plating technology.
(* Patent No. 6300213)
By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
Elephantech will continue to reduce its environmental burden and contribute to the achievement of SDGs.
|Substrate||Transparent heat-resistant PET film: 50 µm thick,
125 µm thick
PI (Polyimide) film: 25 µm thick
|Line width / interval||200/200 μm min., 200/150 μm min. (option)|
|Hole diameter||0.5 mm min.|
|Outline-pattern spacing||0.3 mm min.|
|Copper foil thickness||3 μm (please consult us if you require a thickness of more than 3 µm)|
|Panel size||180 × 270 mm max.|
|Soldermask application||UV inkjet printing (green) (waterproof graded soldermask coating is possible for special items)
Transparent and black soldermask coating by silkscreen printing for PET substrate is also under development and may be available upon request.
|Legend printing||UV inkjet printing (white)|
|Surface treatment||Oxidation prevention treatment, Electroless nickel gold plating (option)|
|Outline trimming / Hole processing||Laser cutting|
|SMT process||Subject to negotiation|
|Stiffeners||When specifying the thickness of the connector part, film stiffeners can be used to adapt to connectors of 200 µm or 300 µm in total thickness.
Component mounted parts and such can be adapted by using FR4 stiffeners of 0.1, 0.3, 0.5, 1.0, and 1.6mm in thickness.
Other stiffeners, electromagnetic wave shield film, double-sided tape and such are also available.
|Inspection||Optical inspection + opens/shorts test|
|Address||4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan|
|Representative||Shinya Shimizu, CEO|
|Business description||Development of printed electronics manufacturing technology and provision of related services|