Regarding the color variations for the soldermask, clear, black and white are available as custom silk-screen printed options as well as the standard green color by UV inkjet.

 

soldermask’s color Standard/Custom order Substrate Printing method Gold plating compatibility Soldermask thickness(TYP) Alignment precision(between the soldermask opening and the copper pattern) Alignment precision(between soldermask openings)
Green Standard PET / PI UV inkjet Compatible 20μm 0.2mm 0.2mm
Green(waterproof) Custom order PET UV inkjet Compatible 50μm 0.2mm 0.2mm
 Clear Custom order PET Silk-screen printed Subject to negotiation 20μm 0.5mm *1 0.2mm *2
White・Black Custom order PET Silk-screen printed  Subject to negotiation 20μm 0.5mm *1 0.2mm *2
*1 : Under 0.5mm is negotiable
*2 : Requires verification for each individual unit

Please note the following regarding these custom color options (clear, black, white):
-The base substrate must be PET
-Accuracy and conditions are different from the specifications since the printing method is not UV inkjet.

Please contact us for details. contact: https://www.elephantech.co.jp/contact/ -With the custom silk-screen printing, certain gold plating patterns may be unavailable in some cases. Please contact us for details.

*The legend color of P-Flex™ will be replaced from black to white in May 2019 (both PET substrate and polyimide base materials).

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About P-Flex™

P-Flex™ is a single-face flex PCB manufactured using the Pure Additive™ method. Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.

Pure-Additive-method

The Pure Additive™ method (*) developed by Elephantech is a concept completely opposite to what had been used until now, using a proprietary manufacturing technology that prints metal nanoparticles with inkjet only on the necessary parts and grows metals by electroless plating technology.
(* Patent No. 6300213 acquired)

By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
Elephantech will continue to reduce its environmental burden and contribute to the achievement of SDGs.

P-Flex™️ manufacturing specifications
Substrate Transparent heat-resistant PET film: 50 µm thick, 125 µm thick
PI (Polyimide) film: 25 µm thick
Line width / interval 200/200 μm min., 200/150 μm min. (option)
Hole diameter 0.5 mm min.
Outline-pattern spacing 0.3 mm min.
Temperature during continuous use Between -20°C and +105°C
Copper foil thickness 3 μm (please consult us if you require a thickness of more than 3 µm)
Panel size 180 × 270 mm max.
Wiring layer Single-sided
Soldermask application UV inkjet printing (green) (waterproof graded soldermask coating is possible for special items)
Transparent and black soldermask coating by silkscreen printing for PET substrate is also under development and may be available upon request.
Legend printing UV inkjet printing (white)
Surface treatment Oxidation prevention treatment, Electroless nickel gold plating (option)
Outline trimming / Hole processing Laser cutting
SMT process Subject to negotiation
Stiffeners When specifying the thickness of the connector part, film stiffeners can be used to adapt to connectors of 200 µm or 300 µm in total thickness.
Component mounted parts and such can be adapted by using FR4 stiffeners of 0.1, 0.3, 0.5, 1.0, and 1.6mm in thickness.
Other stiffeners, electromagnetic wave shield film, double-sided tape and such are also available.
Inspection Optical inspection + opens/shorts test
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Company information
Name Elephantech Inc.
Establishment January 2014
Address 4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan
Capital JPY 381,050,000
Representative Shinya Shimizu, CEO
Business description Development of printed electronics manufacturing technology and provision of related services
URL https://www.elephantech.co.jp/en/
Email hello_en@elephantech.co.jp