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P-Flex™ is a single-face flex PCB manufactured using the Pure Additive™ method. Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.
The Pure Additive™ method (*) developed by Elephantech is a concept completely opposite to what had been used until now, using a proprietary manufacturing technology that prints metal nanoparticles with inkjet only on the necessary parts and grows metals by electroless plating technology.
(* Patent No. 6300213 acquired)
By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
Elephantech will continue to reduce its environmental burden and contribute to the achievement of SDGs.
| Substrate | Transparent heat-resistant PET film: 50 µm thick,
125 µm thick PI (Polyimide) film: 25 µm thick |
| Line width / interval | 200/200 μm min., 200/150 μm min. (option) |
| Outline-pattern interval | Standard : 0.5 mm min.High : 0.3 mm min. |
| Temperature during continuous use | Between -20°C and +105°C |
| Copper foil thickness | 3μm / 6µm (option) |
| Panel size | 180 × 270 mm max. |
| Wiring layer | Single-sided |
| Soldermask application | UV inkjet printing (green) |
| Legend printing | Black UV inkjet (we plan on switching to a white color from May 2019) |
| Surface treatment | Oxidation prevention treatment, Electroless nickel gold plating (option) |
| Outline trimming / Hole processing | Laser cutting |
| SMT process | Subject to negotiation |
| Stiffeners alignment | Available (Connector part thickness alignment, mount part stiffener) |
| Inspection | Optical inspection + opens/shorts test |