P-Flex® is a single-face flex PCB manufactured using the Pure Additive™ method. Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.
The Pure Additive™ method (*) developed by Elephantech is a concept completely opposite to what had been used until now, using a proprietary manufacturing technology that prints metal nanoparticles with inkjet only on the necessary parts and grows metals by electroless plating technology.
(* Patent No. 6300213)
Taking the example of printed circuit boards, the conventional manufacturing method was an extremely long process in which copper foil is manufactured, laminated with film (production of CCL), and laminated with photosensitive materials before the desired copper pattern is achieved by dissolving and discarding the copper foil from unnecessary parts by exposure, development and etching.
Our process achieves the desired copper pattern by printing the metal onto film and growing it, not only forgoing the need for copper foil manufacturing and CCL manufacturing processes but also eliminating the need for the etching process to dissolve and discard the copper foil.
By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
Elephantech will continue to reduce its environmental burden and contribute to the achievement of SDGs.
|Substrate||Transparent heat-resistant PET film: 50 µm thick,
125 µm thick
PI (Polyimide) film: 25 µm thick
|Line width / spacing||200/200 μm min., 200/150 μm min. (option)|
|Hole diameter||0.5 mm min.|
|Outline-pattern spacing||0.3 mm min.|
|Copper foil thickness||3 μm (please consult us if you require a thickness of more than 3 µm)|
|Panel size||180 × 270 mm max.|
|Soldermask coating||UV inkjet printing (green) (waterproof graded soldermask coating is possible for special items)
Transparent, black and white soldermask coatings by silkscreen printing for PET substrate are also under development and may be available upon request.
|Legend printing||UV inkjet printing (white)|
|Surface finish||Oxidation prevention treatment, Electroless nickel gold plating (option)|
|Outline cutting / Hole drilling||Laser cutting|
|Stiffeners||When specifying the thickness of the connector part, film stiffeners can be used to adapt to connectors of 200 µm or 300 µm in total thickness.
Component mounted parts and such can be adapted by using FR4 stiffeners of 0.1, 0.3, 0.5, 1.0, and 1.6mm in thickness.
Other stiffeners, electromagnetic wave shield film, double-sided tape and such are also available.
|Inspection||Visual inspection + opens/shorts test|
|Address||4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan|
|Representative||Shinya Shimizu, CEO|
|Business description||Development of printed electronics manufacturing technology and provision of related services|