Elephantech’s proprietary printable
electronics technology simplifies the flexible
PCB manufacturing process significantly.

Elephantech’s proprietary printable electronics technology simplifies the flexible PCB manufacturing process significantly.

Pure Additive™️ processing

This manufacturing method consists of inkjet-printing silver nano-ink onto the substrate before electroless copper plating is applied to form the circuit.
By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
* Patent No. 6300213

Original manufacturing method enabling ultrafast delivery(Patented)

Features

P-Flex® is a single-face flex PCB manufactured using the Pure Additive™ method.
Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.

The novel approach to electronic circuit production that Elephantech has developed -- called Pure Additive™ processing -- is based on a totally opposite concept to the conventional method. In this innovative manufacturing method, metallic nano particles are printed only onto the required areas of the board surface, and then electroless plating technology is applied to grow the metal, providing the benefits shown on the below.

Lead Time Shortened

  • Widely backed up with standard specifications shipped/developed 3 days after data issue.
  • Because the manufacturing schedule is short, early delivery of mass produced parts is supported.

Total cost reduced

  • Cost from development time to mass production time greatly reduced.
  • Since copper is only placed where it is needed, less than 30%* of material is used.

Contribute to SDGs (Sustainable Development Goals)

  • Since copper is only placed where it is needed, less than 30%* of material is used.
  • The shortening of the process allows for a drainage volume of less than 10%*
Manufacturing process based on the Pure Additive™ processing
processing
About RoHS / REACH (EU regulations on chemical substances)

All flexible PCB manufactured by Elephantech fully comply with RoHS and REACH.


Both RoHS and REACH are regulatory directives promulgated by the European Union (EU) concerning chemical substances, placing a tight restriction on sales and distribution of noncomplying products within the European Union. While RoHS is a simple directive restricting the use of ten substances, including lead, in products, REACH on the other hand demands a more comprehensive risk management, such as pre-registration and registration with the EU, for over 50,000 types of chemical substances.


Since the manufacturer is responsible for certifying the compliance to the directive, customers who aim to sell in the EU needed to confirm that Elephantech's flexible PCB complies to RoHS / REACH. The recent inspection has confirmed that Elephantech's flexible PCB is not subject to either restriction, and Elephantech's flexible PCB may be used in your products without having to take specific actions.

Features of the PET FPC P-Flex®

Standard single-sided FPC

It is inexpensive to mass produce compared to polyimide base materials, and it is suitable for environments with high or extreme humidity due to it being resistive to absorbing moisture. Also, parts other than the pattern or components can have a transparent appearance when transparent resist is used.

P-Flex PET: standard single-sided FPC
About the soldermask’s color of the Flexible Printed Circuit Board P-Flex® using PET substrate

Features of the Polyimide FPC P-Flex®

Features of the Polyimide FPC P-Flex®
Standard single-sided FPC

The Polyimide-base P-Flex® (hereinafter P-Flex® PI) is an FPC (Flexible Printed Circuit) where our very own Pure Additive method(*1) is adapted to polyimides. The PET based P-Flex® (hereinafter P-Flex® PET) we had developed and sold until now had issues with its range of use limited by the low heat resistance of PET (roughly 150˚C) and having to use low temperature solder for mounting. This P-Flex® PI uses polyimides with high heat resistance (roughly 300˚C) as its base material, allowing it to overcome the shortcomings of P-Flex® PET and improving heat resistance and flame retardancy. Regarding the mounting of parts, the ability to use normal solder has not only expanded the applications but also greatly improved the mountability, and it can now be used just as if it was any normal FPC.

* An internal investigation

https://info.elephantech.co.jp/p-flex-polyimide-fpc

About the soldermask’s color of the Flexible Printed Circuit Board P-Flex® using PET substrate

Regarding the color variations for the soldermask, clear, black and white are available as custom silk-screen printed options as well as the standard green color by UV inkjet.


Please note the following regarding these custom color options (clear, black, white):

-The base substrate must be PET
-Accuracy and conditions are different from the specifications since the printing method is not UV inkjet.
-With the custom silk-screen printing, certain gold plating patterns may be unavailable in some cases. Please contact us for details.

*The legend color of P-Flex® will be replaced from black to white in May 2019 (both PET substrate and polyimide base materials).

About the soldermask’s color of the Flexible Printed Circuit Board P-Flex® using PET substrate

LINK




Please contact us via the form below for your technical questions. Subscribe to our newsletter to get informed about new products and technologies.

About P-Flex®

P-Flex® is a single-face flex PCB manufactured using the Pure Additive™ method. Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.

Pure-Additive-method

The Pure Additive™ method (*) developed by Elephantech is a concept completely opposite to what had been used until now, using a proprietary manufacturing technology that prints metal nanoparticles with inkjet only on the necessary parts and grows metals by electroless plating technology.
(* Patent No. 6300213)

By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
Elephantech will continue to reduce its environmental burden and contribute to the achievement of SDGs.

P-Flex® manufacturing specifications
Substrate Transparent heat-resistant PET film: 50 µm thick, 125 µm thick
PI (Polyimide) film: 25 µm thick
Line width / spacing 200/200 μm min., 200/150 μm min. (option)
Hole diameter 0.5 mm min.
Outline-pattern spacing 0.3 mm min.
Copper foil thickness 3 μm (please consult us if you require a thickness of more than 3 µm)
Panel size 180 × 270 mm max.
Wiring layer Single-sided
Soldermask coating UV inkjet printing (green) (waterproof graded soldermask coating is possible for special items)
Transparent, black and white soldermask coatings by silkscreen printing for PET substrate are also under development and may be available upon request.
Legend printing UV inkjet printing (white)
Surface finish Oxidation prevention treatment, Electroless nickel gold plating (option)
Outline cutting / Hole drilling Laser cutting
Stiffeners When specifying the thickness of the connector part, film stiffeners can be used to adapt to connectors of 200 µm or 300 µm in total thickness.
Component mounted parts and such can be adapted by using FR4 stiffeners of 0.1, 0.3, 0.5, 1.0, and 1.6mm in thickness.
Other stiffeners, electromagnetic wave shield film, double-sided tape and such are also available.
Inspection Visual inspection + opens/shorts test
contact us

Company information
Name Elephantech Inc.
Establishment January 2014
Address 4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan
Capital JPY 1.281 billion
Representative Shinya Shimizu, CEO
Business description Development of printed electronics manufacturing technology and provision of related services
URL https://www.elephantech.co.jp/en/
Email hello_en@elephantech.co.jp