STATUS : Under development | Preparing for production | Ready for production | In production

Ultra-thin single sided + Ag paste jumper FPC

Major specs values
L/S 200 / 150 μm
Layer Single layer
Size 270 x 180 mm
Surface treatment Cu or ENIG
Substrate 5 μm Polyimide

Antennas, touch sensors, in-mold circuits

RFID, small thin IoT devices, mobiles


Please contact us via the form below for your technical questions. Subscribe to our newsletter to get informed about new products and technologies.