STATUS : Under development | Preparing for production | Ready for production | In production


Ultra-thin single sided + Ag paste jumper FPC

Major specs values
L/S 200 / 150 μm
Layer Single layer
Size 270 x 180 mm
Surface treatment Cu or ENIG
Substrate 5 μm Polyimide

Applications
Antennas, touch sensors, in-mold circuits


Industries
RFID, small thin IoT devices, mobiles

 






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