STATUS : Under development | Preparing for production | Ready for production | In production

Ultra-thin single sided + Ag paste jumper FPC

Ultra-thin single sided + Ag paste jumper FPC


Major specs values
L/S 200/150μm
Layer Single layer
Size 270x180mm
Surface treatment Cu or ENIG
Substrate 5μm Polyimide

Applications
Antennas, touch sensors, in-mold circuits


Industries
RFID, small thin IoT devices, mobiles

 






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Company information and contact

Name Elephantech Inc.
Representative Shinya Shimizu, CEO
Establishment January 2014
Capital JPY 458,390,000 (including capital reserve)
No.of employees 23
Address 4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan
URL https://www.elephantech.co.jp/en/