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P-Flex® is a Flex PCB

Features of the Flexible Substrate P-Flex®

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Features of the Flexible Substrate P-Flex®

片面フレキシブル基板 P-Flex®
P-Flex® is a Flex PCB manufactured using the Pure Additive™ processing.

Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.

The novel approach to electronic circuit production that Elephantech has developed -- called Pure Additive™ processing -- is based on a totally opposite concept to the conventional method. In this innovative manufacturing method, metallic nano particles are printed only onto the required areas of the board surface, and then electroless plating technology is applied to grow the metal, providing the benefits shown below.

Lead Time Shortened

  • Widely backed up with standard specifications shipped/developed 3 days after data issue.
  • Because the manufacturing schedule is short, early delivery of mass produced parts is supported.

Total cost reduced

  • Cost from development time to mass production time greatly reduced.
  • Our factory has a monthly production capacity of 1000 m² and we can handle and support mass production.

Contribute to SDGs (Sustainable Development Goals)

  • Since copper is only placed where it is needed, less than 30%* of material is used.
  • The shortening of the process allows for a drainage volume of less than 10%*

* An internal investigation

About Elephantech's manufacturing method (Pure Additive™️ processing)

This manufacturing method consists of inkjet-printing silver nano-ink onto the substrate before electroless copper plating is applied to form the circuit.
By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
* Patent No. 6300213

The world's first practical application using printing technology

Original manufacturing method enabling ultrafast delivery(Patented)

In addition, the etching / subtractive method needs;

「Print the metal you need」→ There's no waste.

Before: 「Etching unnecessary metal」→ Lot of waste.

Now:「Print the metal you need」→ There's no waste.

800350en-pure-add

Our original pure additive™ processing

This manufacturing method consists of inkjet-printing silver nano-ink onto the substrate before electroless copper plating is applied to form the circuit.
Manufacturing process based on the Pure Additive™ processing

Manufacturing process

By producing with the Pure Additive™️ processing, we were able to halven the manufacturing process for flexible substrates as compared to the previous method and speed up production to achieve the shortest ever delivery time.
_Y4_1194

JVA2021 Award Ceremony: A short speech by our CEO, Shinya Shimizu.

Here is a short speech from our CEO, Shinya Shimizu, at the "Japan Venture Awards 2021" ceremony held on March 1.
NHK

NHK WORLD-JAPAN News Broadcast

The contents of an interview the NHK International Broadcasting Station had with us has been broadcast in English on the NHK WORLD-JAPAN News.
 
 About Design Data Formats
Circuit design data format Extension
RS-274X(Extended Gerber format) Extensions defined in .gbr or CAD
Illustrator .ai
AutoCAD .dxf
CADLUS® PCB CADLUS Compressed data (.COMP Data)
PDF Instructions in, etc. .pdf
 
 PCB CAD Tool – Extended Gerber file output possible
Company name CAD tool name
Cadence ORCAD & ALLEGRO
AutoDesk EAGLE
Mentor Graphics PADS
Altium Altium Designer (AD18, AD19)
Zuken CR-5000/8000 CADVANCE
Quadcept Inc. Quadcept
NISOUL CO.,LTD CADLUS
Open Source KiCad
Contribute to the SDGs (Sustainable Development Goals)
04_ecology_PC_en_rev01

 

This technology enables sustainable manufacturing amid the increasing depletion of resources that our world faces.
Also, the reduced consumption of energy and materials also enables a 20 to 50% reduction in cost when compared to conventional methods.

環境負荷削減の独自製法で SDGs に貢献

Contributing to the Sustainable Development Goals (SDGs)

Elephantech’s efforts to Reduce Environmental Impact by Pure Additive™️ processing.
Making the world sustainable with new manufacturing technologies

Making the world sustainable with new manufacturing technologies

Moving forward, we plan to further accelerate our technological development in pursuit of achieving a sustainable world.
Advantages of using AM in the manufacturing of the Flexible Substrate P-Flex®
Additive Manufacturing Center

By leading the world with AM, we aim to make AM a major manufacturing method in Electronics, Healthcare, Textile and Optics.


*AM(Additive Manufacturing) uses inkjet and other printing technologies to selectively stack materials onto desired areas.

IMPC® (In-Mold Printed Circuit)

IMPC®(In-Mold Printed Circuits) is a design and manufacturing solution that provides an integrated, optimized design for the entire component instead of the traditional manufacturing method where plastics and electronic circuits are designed and manufactured separately.

Pure Additive™ processing

This manufacturing method consists of inkjet-printing silver nano-ink onto the substrate before electroless copper plating is applied to form the circuit. By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.

About FlexiblePrintedCircuits
  
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