Features of the P-Flex® Flexible PCB

P-Flex® is a Flex PCB manufactured with Pure Additive™ processing. Until now, electronic circuits were made by subtractive manufacturing where the entire surface is layered with metal before dissolving the unnecessary parts. This method of fabrication requires many different processes such as copper foil production, film laminating, circuit exposure, development and etching. Furthermore, there is also the issue of the method's environmental impact due to the need to dissolve and dispose of the copper foil from unnecessary parts.

The Pure Additive™ processing developed by Elephantech takes an entirely different approach, combining inkjet printing and electroless copper plating technologies to print metal nanoparticles only where necessary for the circuit formulation and growing the metals on top. This new manufacturing method comes with the following advantages:

片面フレキシブル基板 P-Flex®

Shortened lead time and reduction in total cost

  • Standard specifications can be shipped in as little as 3 days from data submission, greatly supporting product development. Revisions to the design can also be carried out with digital processing alone.
  • Shortened manufacturing process allows swift delivery for mass production.
  • Greatly reduces cost, from development to mass production.
  • Our mass production facility in Nagoya allows us to be fully prepared for large-scale mass produciton.
About Elephantech's manufacturing method (Pure Additive™️ processing)

This manufacturing method consists of inkjet-printing silver nano-ink onto the substrate before electroless copper plating is applied to form the circuit.
By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
* Patent No. 6300213

The world's first practical application using printing technology

Original manufacturing method enabling ultrafast delivery(Patented)

Our original pure additive™ processing

This manufacturing method consists of inkjet-printing silver nano-ink onto the substrate before electroless copper plating is applied to form the circuit.
Manufacturing process based on the Pure Additive™ processing

Manufacturing process

By producing with the Pure Additive™️ processing, we were able to halven the manufacturing process for flexible substrates as compared to the previous method and speed up production to achieve the shortest ever delivery time.

JVA2021 Award Ceremony: A short speech by our CEO, Shinya Shimizu.

Here is a short speech from our CEO, Shinya Shimizu, at the "Japan Venture Awards 2021" ceremony held on March 1.

NHK WORLD-JAPAN News Broadcast

The contents of an interview the NHK International Broadcasting Station had with us has been broadcast in English on the NHK WORLD-JAPAN News.
Layer configuration of P-Flex🄬
Layer configuration of P-Flex🄬
* It is shown by expanding it in the thickness direction for clarity.
Contribute to the SDGs (Sustainable Development Goals)
環境負荷削減の独自製法で SDGs に貢献

Contributing to the Sustainable Development Goals (SDGs)

Elephantech’s efforts to Reduce Environmental Impact by Pure Additive™️ processing.
Making the world sustainable with new manufacturing technologies

Making the world sustainable with new manufacturing technologies

Moving forward, we plan to further accelerate our technological development in pursuit of achieving a sustainable world.


Case Study
P-Flex® Design Win for EIZO Corporation’s FlexScan® EV3895 Ultrawide, Curved Monitor

Elephantech's P-Flex® has been adopted by EIZO Corporation for the mass production of its FlexScan® EV3895 monitor and is used in its control switches.

Elephantech's P-Flex® Design Win for FUKUDA's Air Leak Test Systemfor Packaging Containers MSQ-2000 series

Elephantech Inc. is pleased to announce that the company's Flex PCB P-Flex® has been successfully awarded for commercial production by FUKUDA Co., Ltd. for its Air Leak Test System for package containers MSQ-2000 series.

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