P-Flex® - Standard manufacturing specifications

Substrate

Min. Pattern Width/Spacing (L/S)

200/200μm（PET 200/150μm is available at additional costs and delivery times. ）

Copper foil thickness

3µm（If you would like more than 3μm thick for PET, please contact us separately.）

Wiring layer

Single-sided

Copper pattern surface finish

Anti-oxidation treatment (standard), electroless Ni-Au plating (additional cost and delivery date)

Soldermask coating

UV inkjet printing method (Transparent / 30µm thickness) (special product: waterproof grade resist application colorless / 50µm thickness)
Developed product: White and black soldermask by silkscreen printing ( for PET substrate)

Legend Printing

UV inkjet printing method (white)

Panel Size

180 × 270mm Max. 

Outline cutting / Hole drilling

Laser-cut  (min. hole diameter: 0.5 mm)

Stiffeners

Connector insertion: total thickness 200μm, 300μm compatible (outer cut for each Stiffeners) Part mounting unit: 0.1, 0.3, 0.5, 1.0, 1.6mm FR-4 plate (min. Stiffeners width: 5mm)
Other electromagnetic shielding films, double-sided tape, etc. available

Inspection

V/M inspection + Open short test

Min. mounting part size (ref. data)

0603(Length:0.6mm x Width:0.3mm)、0201(inch) / PET, PI

Reflow heat resistance

PET: 200℃ / 5 seconds、　PI: 260℃ /10 seconds

Continuous operating temp.

-20℃～+105℃

current capacity (reference data)

Trace width 0.8mm: 0.5A (+10 ℃ increase), 1A (+40 ℃ increase) Trace width 3mm: 1A (+10 ℃ increase), 2A (+40 ℃ increase)

Min. bend radius (reference data)

0.5mm (3umCopper foil thickness/PET)