Positioning of this manufacturing specification
These manufacturing specifications are the basic specifications for P-Flex® production, and details can be agreed upon through individual consultation. For particular specifications, please get in touch with us.
|Base film||PI (Polyimide) film: 25 µm thick|
|Minimum Line width / spacing||100 / 100 μm|
|Minimum Hole diameter||0.5 mm min.|
|Minimum Outline - Pattern Spacing||
0.3 mm min.
|Standard copper plating layer thickness||3 μm, 6 μm, 9 μm, 12 μm (More than or equal to each setting value)|
|Maximum Panel size||393 x 223 mm|
|Wiring layer||Single-sided Only|
|Coverlay||PI film 12.5 µm, adhesion layer 25 µm|
|Legend printing||UV inkjet printing (white)|
|Surface treatment||Oxidation prevention treatment, Electroless Nickel-Gold plating Electro Nickel-Gold plating|
|Outline cutting||Laser cutting or Die punching|
|Hole drilling||Laser cutting or Die punching|
|Stiffeners||When specifying the thickness of the connector part, film stiffeners can be used to adapt to connectors of 200 µm or 300 µm.
Component mounted parts and such can be adapted by using FR4 stiffeners of 0.1, 0.3, 0.5, 1.0, and 1.6mm in thickness.
Other stiffeners, electromagnetic wave shield film, double-sided tape and such are also available.
|Inspection||Visual inspection + opens/shorts test|