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Highly accurate inkjet-printing of silver nanoparticle ink

Failure of head/ink control

Failure of head/ink
control


Failureofink-surfacecontrol

Failure of ink/surface control


Fullycontrolled

Fully controlled
(150μm line)



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About P-Flex®

P-Flex® is a single-face flex PCB manufactured using the Pure Additive™ method. Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.

Pure-Additive-method

The Pure Additive™ method (*) developed by Elephantech is a concept completely opposite to what had been used until now, using a proprietary manufacturing technology that prints metal nanoparticles with inkjet only on the necessary parts and grows metals by electroless plating technology.
(* Patent No. 6300213)

By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
Elephantech will continue to reduce its environmental burden and contribute to the achievement of SDGs.

P-Flex® manufacturing specifications
Substrate Transparent heat-resistant PET film: 50 µm thick, 125 µm thick
PI (Polyimide) film: 25 µm thick
Line width / spacing 200/200 μm min., 200/150 μm min. (option)
Hole diameter 0.5 mm min.
Outline-pattern spacing 0.3 mm min.
Copper foil thickness 3 μm (please consult us if you require a thickness of more than 3 µm)
Panel size 180 × 270 mm max.
Wiring layer Single-sided
Soldermask coating UV inkjet printing (green) (waterproof graded soldermask coating is possible for special items)
Transparent, black and white soldermask coatings by silkscreen printing for PET substrate are also under development and may be available upon request.
Legend printing UV inkjet printing (white)
Surface finish Oxidation prevention treatment, Electroless nickel gold plating (option)
Outline cutting / Hole drilling Laser cutting
Stiffeners When specifying the thickness of the connector part, film stiffeners can be used to adapt to connectors of 200 µm or 300 µm in total thickness.
Component mounted parts and such can be adapted by using FR4 stiffeners of 0.1, 0.3, 0.5, 1.0, and 1.6mm in thickness.
Other stiffeners, electromagnetic wave shield film, double-sided tape and such are also available.
Inspection Visual inspection + opens/shorts test
contact us

Company information
Name Elephantech Inc.
Establishment January 2014
Address 4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan
Capital JPY 1.281 billion
Representative Shinya Shimizu, CEO
Business description Development of printed electronics manufacturing technology and provision of related services
URL https://www.elephantech.co.jp/en/
Email hello_en@elephantech.co.jp