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Original manufacturing method enabling ultrafast delivery(Patented)

About Elephantech's manufacturing method (Pure Additive™️ processing)

This manufacturing method consists of inkjet-printing silver nano-ink onto the substrate before electroless copper plating is applied to form the circuit.
By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
* Patent No. 6300213

Original manufacturing method enabling ultrafast delivery(Patented)

Features

P-Flex® is a single-face flex PCB manufactured using the Pure Additive™ method.
Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.

The novel approach to electronic circuit production that Elephantech has developed -- called Pure Additive™ processing -- is based on a totally opposite concept to the conventional method. In this innovative manufacturing method, metallic nano particles are printed only onto the required areas of the board surface, and then electroless plating technology is applied to grow the metal, providing the benefits shown on the right.

Lead Time Shortened

  • Widely backed up with standard specifications shipped/developed 3 days after data issue.
  • Because the manufacturing schedule is short, early delivery of mass produced parts is supported.

Total cost reduced

  • Cost from development time to mass production time greatly reduced.
  • Our factory has a monthly production capacity of 1000 m² and we can handle and support mass production.

Contribute to SDGs (Sustainable Development Goals)

  • Since copper is only placed where it is needed, less than 30%* of material is used.
  • The shortening of the process allows for a drainage volume of less than 10%*

* An internal investigation

NHK WORLD-JAPAN News Broadcast

Manufacturing process based on the Pure Additive™ processing
processing
 
P-Flex® manufacturing specifications
Substrate Transparent heat-resistant PET film: 50 µm thick, 125 µm thick
PI (Polyimide) film: 25 µm thick
Line width / spacing 200/200 μm min., 200/150 μm min. (only PET substrate option)
Hole diameter 0.5 mm min.
Outline-pattern spacing 0.3 mm min.
Copper foil thickness 3 μm (please consult us if you require a thickness of more than 3 µm)
Panel size 180 × 270 mm max.
Wiring layer Single-sided
Soldermask coating
(for PET substrate only)
UV inkjet printing method (transparent) (can also be specially ordered with a waterproof grade soldermask coating)
For PET substrates, green, white and black soldermask coating by silk screen printing is also available as a developmental product.
Coverlay pasting
(for PI substrate only)
PI film 12.5 µm, adhesion layer 15 µm
Only coverlay pasting is available for PI substrates
Legend printing UV inkjet printing (white)
Surface finish Oxidation prevention treatment, Electroless nickel gold plating (option)
Outline cutting / Hole drilling Laser cutting
Stiffeners When specifying the thickness of the connector part, film stiffeners can be used to adapt to connectors of 200 µm or 300 µm in total thickness.
Component mounted parts and such can be adapted by using FR4 stiffeners of 0.1, 0.3, 0.5, 1.0, and 1.6mm in thickness.
Other stiffeners, electromagnetic wave shield film, double-sided tape and such are also available.
Inspection Visual inspection + opens/shorts test
LINK

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