Shifting from “dissolving unnecessary parts” to “printing onto necessary parts”

Our original pure additive™ processing

About Elephantech's manufacturing method
Pure Additive™️ processing

The Pure Additive™ processing developed by Elephantech takes an entirely different approach, combining inkjet printing and electroless copper plating technologies to print metal nanoparticles only where necessary for the circuit formulation and growing the metals on top.

Original manufacturing method enabling ultrafast delivery(Patented)
Taking the example of printed circuit boards, the conventional manufacturing method was an extremely long process in which copper foil is manufactured, laminated with film (production of CCL), and laminated with photosensitive materials before the desired copper pattern is achieved by dissolving and discarding the copper foil from unnecessary parts by exposure, development and etching.

Our process achieves the desired copper pattern by printing the metal onto film and growing it, not only forgoing the need for copper foil manufacturing and CCL manufacturing processes but also eliminating the need for the etching process to dissolve and discard the copper foil.
Our original pure additive™ processing

Before: 「Etching unnecessary metal」→ Lot of waste.

Now:「Print the metal you need」→ There's no waste.

Proprietary Technology
Highly accurate inkjet-printing of silver nanoparticle ink


Highly accurate inkjet-printing of silver nanoparticle ink

Failure of head/ink control

Failure of head/ink
control


Failureofink-surfacecontrol

Failure of ink/surface control


Fullycontrolled

Fully controlled
(150μm line)



 

Original bath control and surface technology enables 10x faster electroless Cu plating

Conventional electroless Cu plating is slow because of its speed-stability trade-off

Conventional electroless Cu plating is slow because of its speed-stability trade-off

Original bath control and surface technology enables 10x faster electroless Cu plating

Original bath control and surface technology enables 10x faster electroless Cu plating




Strong metal-substrate adhesion mechanism


When silver nanoparticles are printed and baked after drying, the particles are usually melted together as much as possible to lower the resistance value in the case of printing only silver nanoinks, but in the pure adiabatic method, baking is stopped in the middle to form a porous structure of silver nanoparticles.
The surface resin on the base material is pressed into this porous structure with heat to form a mechanical anchor for the resin metal tube, ensuring strong adhesion.

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Fully on-demand solder masking and cutting
No need for tooling cost in the whole process

No need for tooling cost in the whole process

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