About Elephantech's manufacturing method (Pure Additive™️ processing)
This manufacturing method consists of inkjet-printing silver nano-ink onto the substrate before electroless copper plating is applied to form the circuit.
By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
* Patent No. 6300213
Features
P-Flex™ is a single-face flex PCB manufactured using the Pure Additive™ method.
Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.
The novel approach to electronic circuit production that Elephantech has developed -- called Pure Additive™ processing -- is based on a totally opposite concept to the conventional method. In this innovative manufacturing method, metallic nano particles are printed only onto the required areas of the board surface, and then electroless plating technology is applied to grow the metal, providing the benefits shown on the right.
Lead Time Shortened
- Widely backed up with standard specifications shipped/developed 3 days after data issue.
- Because the manufacturing schedule is short, early delivery of mass produced parts is supported.
Total cost reduced
- Cost from development time to mass production time greatly reduced.
- Our factory has a monthly production capacity of 1000 m² and we can handle and support mass production.
Contribute to SDGs (Sustainable Development Goals)
- Since copper is only placed where it is needed, less than 30%* of material is used.
- The shortening of the process allows for a drainage volume of less than 10%*
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P-Flex™ is a single-face flex PCB manufactured using the Pure Additive™ method. Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.
The Pure Additive™ method (*) developed by Elephantech is a concept completely opposite to what had been used until now, using a proprietary manufacturing technology that prints metal nanoparticles with inkjet only on the necessary parts and grows metals by electroless plating technology.
(* Patent No. 6300213)
By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
Elephantech will continue to reduce its environmental burden and contribute to the achievement of SDGs.
| Substrate | Transparent heat-resistant PET film: 50 µm thick,
125 µm thick PI (Polyimide) film: 25 µm thick |
| Line width / interval | 200/200 μm min., 200/150 μm min. (option) |
| Hole diameter | 0.5 mm min. |
| Outline-pattern spacing | 0.3 mm min. |
| Copper foil thickness | 3 μm (please consult us if you require a thickness of more than 3 µm) |
| Panel size | 180 × 270 mm max. |
| Wiring layer | Single-sided |
| Soldermask application | UV inkjet printing (green) (waterproof graded soldermask coating is possible for special items) Transparent and black soldermask coating by silkscreen printing for PET substrate is also under development and may be available upon request. |
| Legend printing | UV inkjet printing (white) |
| Surface treatment | Oxidation prevention treatment, Electroless nickel gold plating (option) |
| Outline trimming / Hole processing | Laser cutting |
| SMT process | Subject to negotiation |
| Stiffeners | When specifying the thickness of the connector part, film stiffeners can be used to adapt to connectors of 200 µm or 300 µm in total thickness. Component mounted parts and such can be adapted by using FR4 stiffeners of 0.1, 0.3, 0.5, 1.0, and 1.6mm in thickness. Other stiffeners, electromagnetic wave shield film, double-sided tape and such are also available. |
| Inspection | Optical inspection + opens/shorts test |