- About Elephantech's manufacturing method Pure Additive™️ processing
- Proprietary Technology
- Highly accurate inkjet-printing of silver nanoparticle ink
- Original bath control and surface technology enables 10x faster electroless Cu plating
- Strong metal-substrate adhesion mechanism
- Fully on-demand solder masking and cutting
- Inquiry Form
Pure Additive™️ processing
The Pure Additive™ processing developed by Elephantech takes an entirely different approach, combining inkjet printing and electroless copper plating technologies to print metal nanoparticles only where necessary for the circuit formulation and growing the metals on top.
Our process achieves the desired copper pattern by printing the metal onto film and growing it, not only forgoing the need for copper foil manufacturing and CCL manufacturing processes but also eliminating the need for the etching process to dissolve and discard the copper foil.
Before： 「Etching unnecessary metal」→ Lot of waste.
Now：「Print the metal you need」→ There's no waste.
Failure of head/ink
Failure of ink/surface control
Conventional electroless Cu plating is slow because of its speed-stability trade-off
Original bath control and surface technology enables 10x faster electroless Cu plating
When silver nanoparticles are printed and baked after drying, the particles are usually melted together as much as possible to lower the resistance value in the case of printing only silver nanoinks, but in the pure adiabatic method, baking is stopped in the middle to form a porous structure of silver nanoparticles.
The surface resin on the base material is pressed into this porous structure with heat to form a mechanical anchor for the resin metal tube, ensuring strong adhesion.