Subtractive and Pure Additive™ methods
Subtractive method, one of the most common methods, manufactures electronic circuits by applying a thin metallic sheet to the board surface and melting away unrequired sections. Pure Additive™ method prints metallic particles only onto the required ares and apply electroless plating technology.
Pure Additive™ method requires fewer manufacturing steps, providing lower manufacturing cost and shorter lead time.
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Company information and contact
|Representative||Shinya Shimizu, CEO|
|Capital||JPY 458,390,000 (including capital reserve)|
|Address||4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan|