◆ P-Flex (PET substrate) can also be specially ordered with a waterproof grade resist coating.
This water-resistant P-Flex has been evaluated in-house to comply with IPX-6 and may be used in environments prone to dripping water. (however, coating and such is necessary for areas used for component mounting, etc...)
◆ It can also be used in parts that are prone to water intrusion such as equipment used outdoors or in-vehicle body electronics.
◆ Using the water-resistant P-Flex can reduce manufacturing costs as there is no need to waterproof cables with sealing materials or taping.
For general and technical inquiries, please contact us from the form below;
P-Flex™ is a single-face flex PCB manufactured using the Pure Additive™ method. Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.
The Pure Additive™ method (*) developed by Elephantech is a concept completely opposite to what had been used until now, using a proprietary manufacturing technology that prints metal nanoparticles with inkjet only on the necessary parts and grows metals by electroless plating technology.
(* Patent No. 6300213 acquired)
By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
Elephantech will continue to reduce its environmental burden and contribute to the achievement of SDGs.
|Substrate||Transparent heat-resistant PET film: 50 µm thick,
125 µm thick
PI (Polyimide) film: 25 µm thick
|Line width / interval||200/200 μm min., 200/150 μm min. (option)|
|Outline-pattern interval||Standard : 0.5 mm min.High : 0.3 mm min.|
|Temperature during continuous use||Between -20°C and +105°C|
|Copper foil thickness||3μm / 6µm (option)|
|Panel size||180 × 270 mm max.|
|Soldermask application||UV inkjet printing (green)|
|Legend printing||Black UV inkjet
(we plan on switching to a white color from May 2019)
|Surface treatment||Oxidation prevention treatment, Electroless nickel gold plating (option)|
|Outline trimming / Hole processing||Laser cutting|
|SMT process||Subject to negotiation|
|Stiffeners alignment||Available (Connector part thickness alignment, mount part stiffener)|
|Inspection||Optical inspection + opens/shorts test|
|Address||4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan|
|Representative||Shinya Shimizu, CEO|
|Business description||Development of printed electronics manufacturing technology and provision of related services|