water-resistance

◆ P-Flex (PET substrate) can also be specially ordered with a waterproof grade resist coating.
This water-resistant P-Flex has been evaluated in-house to comply with IPX-6 and may be used in environments prone to dripping water. (however, coating and such is necessary for areas used for component mounting, etc...)

◆ It can also be used in parts that are prone to water intrusion such as equipment used outdoors or in-vehicle body electronics.

◆ Using the water-resistant P-Flex can reduce manufacturing costs as there is no need to waterproof cables with sealing materials or taping.

For general and technical inquiries, please contact us from the form below;

About P-Flex™

P-Flex™ is a single-face flex PCB manufactured using the Pure Additive™ method. Conventionally, electronic circuits have been manufactured by applying a method known as lithography, in which a thin metallic sheet is first applied to the board surface, and then unrequired sections are melted away.

Pure-Additive-method

The Pure Additive™ method (*) developed by Elephantech is a concept completely opposite to what had been used until now, using a proprietary manufacturing technology that prints metal nanoparticles with inkjet only on the necessary parts and grows metals by electroless plating technology.
(* Patent No. 6300213 acquired)

By reducing the amount of metal, liquid waste and man-hours, we can lessen manufacturing costs and shorten the lead time.
Elephantech will continue to reduce its environmental burden and contribute to the achievement of SDGs.

P-Flex™️ manufacturing specifications
Substrate Transparent heat-resistant PET film: 50 µm thick, 125 µm thick
PI (Polyimide) film: 25 µm thick
Line width / interval 200/200 μm min., 200/150 μm min. (option)
Outline-pattern interval Standard : 0.5 mm min.High : 0.3 mm min.
Temperature during continuous use Between -20°C and +105°C
Copper foil thickness 3μm / 6µm (option)
Panel size 180 × 270 mm max.
Wiring layer Single-sided
Soldermask application UV inkjet printing (green)
Legend printing Black UV inkjet
(we plan on switching to a white color from May 2019)
Surface treatment Oxidation prevention treatment, Electroless nickel gold plating (option)
Outline trimming / Hole processing Laser cutting
SMT process Subject to negotiation
Stiffeners alignment Available (Connector part thickness alignment, mount part stiffener)
Inspection Optical inspection + opens/shorts test
contact us

Company information
Name Elephantech Inc.
Establishment January 2014
Address 4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan
Capital JPY 381,050,000
Representative Shinya Shimizu, CEO
Business description Development of printed electronics manufacturing technology and provision of related services
URL https://www.elephantech.co.jp/en/
Email hello_en@elephantech.co.jp